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ShenZhen Wan He Xing Electronic Co., Ltd

Showing 11 - 18 of 18, total 2 pages        [First] [Previous] [Next] [Last]

11
12l swith board
12l swith board
Specification: 12 layer
Detail: Min trace width/***ce:10mil Inner&Outlayer copper:2oz Used for high-powered switch board

12
4l + goldfingers
4l + goldfingers
Specification: 4 layer
Detail: Min trace width/***ce:4/4mil Finishing:HASL Min hole:0.3mm Copper:1oz

13
8l mobile
8l mobile
Specification: 8 layer
Detail: Min trace width/***ce;10/10mil Min Hole:16mil Copper:1oz

14
2l,immersion silver
2l,immersion silver
Specification: 2 layer
Detail: Board Thickness:1.6mm Min trace/***ce:8mil Min Hole:12mil Finishing:Immersion Silver

15
14l buried vias
14l buried vias
Specification: 14 layer
Detail: Board Thickness:2.0mm Copper:1oz Buried Vias:1+2+1 Finishing:ENIG

16
1l,al board
1l,al board
Specification: 1 layer
Detail: 1L,AL Board 1.0mm Finishing: ENIG Board Thickness:0.2mm

17
6l high-frequency board
6l high-frequency board
Specification: 6 layer
Detail: 6L,ENIG Material:Rogers Min trace width/***ce:5/5mil Min Hole:12mil Used in Telecommunication

18
2l,power supply
2l,power supply
Specification: 2 layer
Detail: material:FR-4 board thickness:1.0mm surface finish:Imm gold solder:black silkscreen:white
Showing 11 - 18 of 18, total 2 pages        [First] [Previous] [Next] [Last]
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